FusionAP, a Malaysian advanced semiconductor packaging startup, has successfully secured US$2 million in a pre-seed funding round. The investment was co-led by prominent venture capital firms Vertex Ventures Southeast Asia & India and Southern Capital Group. This strategic funding positions the company, founded by industry veterans from Intel and TSMC, to address critical bottlenecks in the global semiconductor supply chain.
Addressing a Critical Industry Bottleneck
The global demand for high-performance chips, driven by artificial intelligence, has made advanced packaging a crucial yet constrained area of the semiconductor industry. FusionAP aims to alleviate this pressure by establishing a geopolitically neutral outsourced semiconductor assembly and test (OSAT) platform. The company will focus on developing 2.5D, 3D, and future-ready packaging solutions for a global clientele of design houses and foundries.
Veteran Leadership and Strategic Vision
The company is helmed by a team with deep industry expertise, instilling significant investor confidence. Founder and CEO Ooi Teng Chow was the first employee at Intel's US$7 billion advanced packaging facility in Malaysia, where he scaled the organization significantly. He is joined by co-founder Peter Chavart, a former General Manager from Intel’s Disaggregation Manufacturing Organization, bringing invaluable technical credibility to the venture.
Funding Allocation and Government Support
The newly acquired US$2 million will be strategically allocated to accelerate the company's growth and technological development. These funds are earmarked for engineering and process integration, research and development, intellectual property creation, and the establishment of pilot capacity. Further bolstering its financial position, FusionAP has also been offered a matching research grant from the Malaysia Science Endowment under the Ministry of Science, Technology and Innovation (MOSTI).
Fostering a Malaysian Advanced Packaging Ecosystem
FusionAP is playing a pivotal role in elevating Malaysia's position within the global semiconductor value chain. The company is a founding member of the Malaysia Advanced Packaging Consortium (MAPC), an industry collaboration aimed at building a homegrown advanced packaging ecosystem. This consortium, which includes partners like SkyeChip, Inari Amertron, Pentamaster, and NSW Automation, fosters co-development and accelerates innovation within the region.
Investor Confidence and Market Opportunity
Investors have highlighted the strategic importance of FusionAP's mission in the current technological landscape. Chan Yip Pang of Vertex Ventures SEA and India noted that advanced packaging is both a critical bottleneck and a key enabler for next-generation semiconductor performance. He expressed excitement in backing the team's deep domain expertise as they build a world-class platform and position Southeast Asia as a key node in the supply chain.
This US$2 million pre-seed funding round marks a significant milestone for FusionAP and a strategic advancement for Malaysia's technology sector. With strong financial backing, government support, and a leadership team of seasoned experts, the company is well-equipped to tackle major challenges in semiconductor packaging. FusionAP's journey will be closely watched as it aims to become a key OSAT player and strengthen Southeast Asia's role in the global chip industry.